6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge. “Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading. The 800G and 1. These challenges are forcing innovation to happen at all levels, including pluggable modules. But pluggable modules still. STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and. STMicroelectronics just entered high-volume production of its PIC100 silicon photonics platform — the manufacturing technology behind the 800G and 1. 6T optical modules going into every major AI data center buildout. For network engineers, this is the plumbing layer beneath your VXLAN EVPN overlays. With 400G modules now the baseline, 800G adoption is surging—especially across AI and hyperscaler environments—while 1. In early 2024, primary North American markets showed only 2. Switch ASICs now integrate HBM and extend fabrics up to 60 miles to. With applications like AI, big data analytics and the cloud spurring the growing demand for low-power, high-bandwidth data transfer, the global silicon photonics market size is expected to reach $7.
