Co-Packaged Optics (CPO) Technology is an integration paradigm wherein photonic components (modulators, detectors, waveguides, and packaging interfaces) are co-located and co-fabricated with high-performance electronics, such as CMOS circuits, within a shared module or at the. Co-Packaged Optics (CPO) Technology is an integration paradigm wherein photonic components (modulators, detectors, waveguides, and packaging interfaces) are co-located and co-fabricated with high-performance electronics, such as CMOS circuits, within a shared module or at the. Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. This integration significantly reduces the. As datacenters strive to meet escalating demands for efficiency and bandwidth, particularly with the integration of AI and ML technologies, optics is poised to play a crucial role in shaping the future of interconnect architecture and performance. As for transmission quality, CPO addresses the problem of overloading. The rise of co-packaged optics (CPO) is transforming modern data centers and high-performance networks by addressing critical challenges such as bandwidth density, energy efficiency, and scalability. CPO enhances interconnect bandwidth and energy efficiency by integrating optics and electronics. OFC 2025 made one thing clear: The transition to Co-Packaged Optics (CPO) switches in data centres is inevitable, driven primarily by the power savings they offer. From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC. Today, we'll share a brief overview of the history of copper and optical interconnects used in data centers, the limitations of existing interconnect solutions, and the future of co-packaged optics. Explore the IP that enables high-performance, scalable AI systems Copper has a major presence in.